AXSYS SI200/SI300

8"/12" Frame Wafer handling inspection system and Wafer Mapping

Application characteristics：

• 8 "/12" wafer with iron ring handling and inspection, integrate the electric table, automatic OCR, Wafer Alignment, and cooperate with the unique Wafer mapping system.
• You can read the wafer mapping of the previous station, review, bincode editing, etc., and continue to upload the mapping to the next station. 
• Select an infrared microscope as an option, for internal damage (inner chipping) inspection

System advantages:

• Integrated Olympus microscope
• Programmable X/Y axis electric motor platform, Wafer ring size up to 16 inches or 440 mm
• Automatic transfer cassette of wafer with ring (avoid direct handling of wafer/product)
• Z auto focus
• Automatic wafer Alignment
• OCR Wafer ID read
• Editable wafer map for various SEMI-standard formats
• Bincode generation and configuration
• SECS/GEM of connection
• Inner Chipping