AXSYS VS1000

Semi-Automatic Bonding Inspection System Post DA/WB

• VS1000 is specially designed for substrate inspection after Die bond and wire bonding.
• Equipped with programmable electric platform and Strip mapping system to realize automatic positioning and manual inspection.
• Software annotation and update mapping for the next station. High reliability, Jam automatic detection.

• Olympus microscope
• programmable electric worktable for substrate or frame up to 310mmx110mm (length x width)
• Track width programmable
• The substrate handling system has built-in interference detection to eliminate "frame bending defects".
• Base electronic mapping and real-time image viewing at the same time
• Bincode generation and configuration
• SECS/GEM connection