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Wafer Sorting/Packaging/Unpacking System
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AXSYS WS300/WS200
6"/8"/12"wafer Sorter
Application characteristics:
Sorter for 6"/8"/12" wafer,A single system can be used for kinds of different size of wafers, thicknesses and warps.
Various kinds of cassettes can be transferred to each other, two sets of mechanical arms can be equipped, and three wafer loading ports can be used for high-speed sorting.
System advantages:
Designed specifically to handle 2 wafer load ports and can be upgraded to 3 load ports.
Programmable loading and unloading wafers directly from different combinations of loading ports seamlessly
Able to perform bidirectional wafer sorting from OC to OC or FOUP or FOSB and vice versa
Supports Wafer Coin Box to FOUP/FOSB
OCR Wafer ID read
Automatic Wafer Alignment
SECS/GEM or TCP/IP connection
Products
Wafer Sorting/Packaging/Unpacking System
Self-owned brand -Axsys
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