WM-5100 Wire Bond Automatic Measurement Machine
Industry Background:
As more and more semiconductor industries have higher and higher requirements for packaging products such as QFN, LGA and BGA, especially for the control effect after wirebond wiring process, some accurate data is needed to control and improve the process, to come true the purposes. Before that most of the process is to use the manual high-power microscope to measure these data, but because these data are artificially measured, it brings some inaccurate, inaccurate data reference value is not better. So to meet the increasing demand for automatic measurement in the semiconductor industry, Your Chance Technology co., ltd (YCT) has developed an equipment WM-5100 specially designed to measure the relevant size of Wire Bond.
Work Principle:
By means of autofocus, the distance between the two focal planes is calculated through the scale of the optical ruler along the z-axis, and the height is constructed.After the image is taken, the distance of X or Y is constructed by calculating each pixel through the algorithm of the software.
WM-5100 Application:
Measure the relative dimension of the semiconductor packaging process especially.
1. 1st bond ball height Automatically found the focal surface of bond ball by the machine, then calculated the distance between it and pad location by the software.
2. Bond ball size Software calculated its X & Y maximum size.
3. Loop height Automatically found the focal surface of wire loop by the machine, then calculated the distance between it and pad location by the software.
4. 2nd bond Software related function to recognize the 2nd bond, calculated its X & Y maximum size.
5. Multiple Dies Same as the signal die method, then transfer to the next die to auto-measure after finishing signal die measurement.
6. Stack Dies Refer to signal Die, different to choice the reference location.
7. Stack bond balls Choose different focal ball surface to auto-focus, the calculated the height same as 1st bond ball.
8. Loop length Choose multiple different positions of same loop, integrated them, software calculated locations to output the length.
WM-5100 Advantages:
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Avoid the mistake of human measurement
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Easy operation (CAD file can be loaded)
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Easy to upload or track data (optional SECS function)
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High repetition accuracy (Z < 0.5um, XY < 1um)
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Customized Report format
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Optional automatic loading and unloading system, finished one magazine at a time
WM-5100 Technology Parameters:
